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| Session 4: Circuit Edit and Beam-based Sample Preparation | ||||
| Location: Ballroom A (Renaissance Austin Hotel) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: This session features papers reviewing
recent studies and technique development that enhance the reliability of circuit edit and TEM sample preparation. Included are the development of a copper etch process that provides variable selectivity sufficient for low-k dielectrics, a quantitative analysis of sub-nanometer FIB deposited Platinum via resistance and advanced in-situ, real-time analysis techniques for monitoring the FIB etching for enhancing trench planarity and endpoint detection. The TEM topics are: a study of FIB electron beam assisted platinum deposition, and the direct observation of crystal and amorphous structures of TEM samples. | ||||
| Editor: | Marsha Abramo Independent Consultant, New York | |||
| Session Chair: | Marsha Abramo Independent Consultant, New York | |||
| 3:05 PM | Development of a Circuit Edit Process Scalable in Dimension and Material | |||
| 3:30 PM | Quantitative Electrical Analysis of FIB Prepared Vias on BiCMOS and CMOS090 Designs | |||
| 3:55 PM | Study on the Effect of FIB Electron Beam Assisted Platinum Deposition on TEM Sample Analysis | |||
| 4:20 PM | Experiment Study on Crystal/Amorphous Structure of TEM Samples Prepared by FIB Milling | |||
| 4:45 PM | Advanced Fringe Analysis Techniques in Circuit Edit | |||