Dr. Alfred C.T. Quah

Principal Engineer
GLOBALFOUNDRIES Singapore Pte Ltd
Product, Test and Failure Analysis
60 Woodlands Industrial Park D Street 2, Singapore 738406
Singapore Singapore 738406

Papers:
Failure Analysis Methodology on Systematic Missing Cu in RAM Due to Cu CMP Failure Analysis Methodology on Resistive Open Defects Applications of AFP Nanoprobing for Localization of Implant Related Issues Effective and Efficient FEOL Defects Localization/ Inspection By Selective Mechanical/Chemical Deprocessing Application of Soft Defect Localization (SDL) for SRAM Soft Failure Debug