40th International Symposium for Testing and Failure Analysis (ISTFA 2014): http://www.asminternational.org/content/Events/istfa/

40th International Symposium for Testing and Failure Analysis (ISTFA 2014)
November 09 - 13, 2014

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Dr. Jie Zhu

GLOBALFOUNDRIES Singapore
QRA-FA
60 Woodlands Industrial Park D, Street 2
Singapore Singapore 738406

Papers:
Tri-Directional TEM Failure Analysis on Sample Prepared By in-Situ Lift-out FIB and Flipstage Observation of Channel Strain Release in pMOS Device with Low Idsat Using Energy-Filtered Nano-Beam Diffraction Technique Application of Automated FIB for TEM Sample Preparation in Semiconductor Failure Analysis Understanding the Cu Void Formation by TEM Failure Analysis

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General Information

November 09 - 13, 2014


Houston, TX