Dr. Changqing Chen

Globalfoundries Singapore
Failure Analysis, Product failure analysis
60 Woodlands Industrial Park D, Street 2, Singapore
Singapore Singapore 738406

Papers:
Failure Analysis Methodology on Systematic Missing Cu in RAM Due to Cu CMP Static Fault Isolation on The Functional Failure of An Digital IC Device Utilizing Nanoprobing and Circuit Diagnostics to Identify Key Failure Mechanism of Otherwise Non-Visible Defects in 20nm Logic Devices Investigation of Protection Layer Materials for Ex-situ 'lift-out' TEM sample Preparation Technique with FIB for 14nm FinFET Understanding the Cu Void Formation by TEM Failure Analysis