12
3D Device Failure Analysis II

Wednesday, November 4, 2015: 3:30 PM-4:45 PM
Meeting Room D137 & 138 (Oregon Convention Center )
Session Chairs:  Dr. Yan Li, Intel, Chandler, AZ and Mr. Frank Altmann, Center for Applied Microstructure Diagnostics (CAM), Fraunhofer Institute for Mechanics of Materials, Halle, Germany
3:30 PM
12.1
3D Integrated Power – A Discrete Perspective
Mr. Ian Kearney, Texas Instruments
3:55 PM
12.2
CANCELLED - Imaging techniques comparison for advanced 3Di devices characterization
Dr. Frederic Lorut, STMicroelectronics; Dr. Nicolas Hotellier, STMicroelectronics; Dr. Sandrine Lhostis, STMicroelectronics; Dr. Fabienne Ponthenier, STMicroelectronics
4:20 PM
12.3
Analysis of Integrated Current Sense in Multiphase Buck Converters
Mr. Ian Kearney, Texas Instruments
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