27
Fault Isolation - Posters

Wednesday, November 4, 2015: 1:30 PM-3:30 PM
Exhibit Hall D (Oregon Convention Center )
Session Chairs:  Dr. Michael Bruce, Consultant, Austin, TX and Dr. Paiboon Tangyunyong, Validation and Failure Analysis, Sandia National Laboratories, Albuquerque, NM
27.1
IR Thermography for Temperature Measurements and Fault Location on AlGaN/GaN HEMTs and MMICs
Mr. Leny BACZKOWSKI, Thales Airborne Systems; Mr. Dominique CARISETTI, Thales Research and Technology; Dr. Laurent BRUNEL, United Monolithic Semiconductors; Mr. Franck VOUZELAUD, Thales Airborne Systems; Prof. Christophe GAQUIERE, IEMN; Dr. Benoit LAMBERT, United Monolithic Semiconductors; Dr. Nicolas SARAZIN, Thales Research and Technology; Mr. Jean-Claude CLEMENT, Thales Research and Technology
27.2
Logic LIVA Fault Isolation in Synthesized Logic
Mr. Tim J. Pifer, Intel; Dr. Travis M. Eiles, Intel Corp.
27.3
How to Locate Resistance VIA by Analyzing Schematic Combined with EMMI Result on Integrated Circuit Failed at Cold Temperature
Mr. Gaojie Wen, Freescale semiconductor
27.4
Comparison of Magnetic Field Imaging and Thermal Laser Stimulation for Detecting Electrically Shorting Defects within a Die BEOL
Mr. Kevin A. Distelhurst, BS/MS Electrical engineering, GLOBALFOUNDRIES
27.5
Isolating Electrically Open Defects Using Space Domain Spectometry With A SQUID
Mr. Kevin A. Distelhurst, BS/MS Electrical engineering, GLOBALFOUNDRIES
27.6
Symptom or Cause? A Case Study
Ms. Anuradha Swaminathan, nVIDIA Corporation; Dr. Joy Y. Liao, nVIDIA Corporation; Mr. Howard Lee Marks, nVIDIA Corporation
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