3D Devices Failure Analysis

Wednesday, November 9, 2016: 8:00 AM-9:40 AM
108 (Fort Worth Convention Center)
Chairs:  Mr. Frank Altmann, Center for Applied Microstructure Diagnostics (CAM), Fraunhofer Institute for Mechanics of Materials, Halle, Germany
Co-chairs:  Ms. Claudia Keller, Infineon, Munich, Germany
8:00 AM
Light-Induced Capacitance Alteration for Non-Destructive Fault Isolation in TSV Structures for 3-D Integration
Dr. Kristof J.P. Jacobs, KU Leuven; Mr. Ahmad Khaled, KU Leuven; Dr. Michele Stucchi, imec; Dr. Teng Wang, imec; Dr. Mario Gonzalez, imec; Dr. Kristof Croes, imec; Prof. Ingrid De Wolf, imec
8:25 AM
3D Fault Isolation in 2.5D Device comprising High Bandwidth Memory (HBM) Stacks and Processor Unit Using 3D Magnetic Field Imaging
Dr. Antonio Orozco, Neocera, LLC; Ms. Florencia Rusli, Neocera; Mr. Christopher Rowlett, Neocera LLC; Ms. Bernice Zee, AMD; Wen Qiu, Advanced Micro Devices; J.M. Chin, Advanced Micro Devices Singapore Pte Ltd; Fang-Jie Foo, AMD
8:50 AM
High resolution x-ray computed tomography : what synchrotron sources can bring to 3Di devices failure analysis
Ms. Alexandra fraczkiewicz, CEA, LETI, MINATEC Campus; Dr. Ennio Capria, ESRF; Dr. Peter Cloetens, ESRF; Dr. Julio Da silva, ESRF; Dr. Amandine Jouve, Univ. Grenoble Alpes; Dr. Sandrine Lhostis, STMicroelectronics; Dr. Frederic Lorut, STMicroelectronics; Thierry Mourier, Univ. Grenoble Alpes; Dr. Pierre Bleuet, Univ. Grenoble Alpes
9:15 AM
Advanced Package FA flow for next-gen packaging technology using EOTPR, 3D XRAY & Plasma FIB
Dr. Christian Schmidt, GLOBALFOUNDRIES; Dr. Jesse Alton, TeraView Limited; Mr. Martin Igarashi, TearView Limited; Mr. Pradip Sairam Pichumani, GLOBALFOUNDRIES; Dr. Lisa Chan, Tescan USA, Inc.; Dr. Ed Principe, Tescan USA, Inc.
See more of: Technical Program
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