Fault Isolation

Sunday, November 6, 2016: 8:00 AM-5:30 PM

108 (Fort Worth Convention Center)

Fault Isolation

Session Chairs: Dr. Mayue Xie, Intel, Chandler, AZ and Mr. David Vallett, PeakSource Analytical, LLC, Fairfax, VT

8:00 AM

Defect localization by Lock-in-Thermography
Mr. Frank Altmann, Fraunhofer Institute for Mechanics of Materials

9:00 AM

Photonic Localization Techniques
Prof. Christian Boit, TUB Technische Universitaet Berlin; Dr. Arkadiusz Glowacki, Berlin University of Technology

10:00 AM

Break

10:30 AM

Technique Selection for Front End of Line Defect Localization in Bulk Si FA
Mr. Gregory M. Johnson, GLOBALFOUNDRIES; Mr. Christopher D'Aleo, GLOBALFOUNDRIES; Mr. Michael Iwatake, GLOBALFOUNDRIES; Dr. Chuan Zhang, GLOBALFOUNDRIES Inc.

12:00 PM

Lunch

1:00 PM

LADA and SDL: Powerful Techniques for Marginal Failures
Mr. Dan Bodoh, NXP Semiconductors; Mr. Kent Erington, NXP Semiconductors

2:30 PM

Magnetic Imaging for Die and Package Fault Isolation
Mr. David Vallett, PeakSource Analytical, LLC

3:30 PM

Break

4:00 PM

Package Level Fault Isolation
Dr. Lihong Cao, Ph.D, ASE US Inc

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