Nanoprobing and Electrical Characterization II

Tuesday, November 7, 2017: 3:40 PM-4:55 PM
Ballroom A (Pasadena Convention Center)
Ms. Sweta Pendyala, Globalfoundries and Mr. John Sanders, DCG Systems
3:40 PM
EBIC on TEM lamellae for improved failure localization and root cause understanding
Dr. Frederic Lorut, STMicroelectronics; Mr. P. Larre, STMicroelectronics; Mrs. CĂ©line Borowiak, STMicroelectronics; Mr. Romain Bon, STMicroelectronics
4:05 PM
Nanoprobing based EBAC technique from backside as well as frontside to isolate logic fails for otherwise non visual defects
Mr. Sreenath Arva, GLOBALFOUNDRIES; Mr. Satish Kodali, GLOBALFOUNDRIES; Dr. Lucile C.Teague Sheridan, Ph.D., GLOBALFOUNDRIES Inc.; Karthik Kalaiazhagan, GLOBALFOUNDRIES Inc.; Mr. Chong Khiam Oh, Globalfoundries Inc. Malta, NY USA
4:30 PM
Fin level defect isolation inside a FinFET using electron beam alteration of current flow
Dr. H. J. Ryu, Intel; Dr. Amish B. shah, Intel; Dr. Yunfei Wang, Intel; Dr. Wen-Hsien Chuang, Intel; Dr. Tom X. Tong, Intel Corp.
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