Nanoprobing and Electrical Characterization II

Tuesday, November 7, 2017: 3:40 PM-4:55 PM

Ballroom A (Pasadena Convention Center)

Ms. Sweta Pendyala, Globalfoundries and Mr. John Sanders, DCG Systems

3:40 PM

EBIC on TEM lamellae for improved failure localization and root cause understanding
Dr. Frederic Lorut, STMicroelectronics; Mr. P. Larre, STMicroelectronics; Mrs. Céline Borowiak, STMicroelectronics; Mr. Romain Bon, STMicroelectronics

4:05 PM

Nanoprobing based EBAC technique from backside as well as frontside to isolate logic fails for otherwise non visual defects
Mr. Sreenath Arva, GLOBALFOUNDRIES; Mr. Satish Kodali, GLOBALFOUNDRIES; Dr. Lucile C.Teague Sheridan, Ph.D., GLOBALFOUNDRIES Inc.; Karthik Kalaiazhagan, GLOBALFOUNDRIES Inc.; Mr. Chong Khiam Oh, Globalfoundries Inc. Malta, NY USA

4:30 PM

Fin level defect isolation inside a FinFET using electron beam alteration of current flow
Dr. H. J. Ryu, Intel; Dr. Amish B. shah, Intel; Dr. Yunfei Wang, Intel; Dr. Wen-Hsien Chuang, Intel; Dr. Tom X. Tong, Intel Corp.

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