Microscopy II

Wednesday, November 8, 2017: 3:30 PM-5:10 PM
Ballroom C (Pasadena Convention Center)
Dr. Tom Schamp, Hitachi High Technologies, America and Dr. Yu Zhu, IBM TJ Watson Research Center
3:30 PM
INVITED: X-ray ptychography for chip-scale imaging
Prof. A. F. J. Levi, Ph.D, University of Southern California
3:55 PM
Automated end-point detection and targeted Ar+ milling of an advanced integrated circuit FIB TEM specimens
Dr. Cecile S. Bonifacio, E.A. Fischione Instruments, Inc.; Dr. Pawel Nowakowski, E.A. Fischione Instruments, Inc.; Dr. Michael J. Campin, E.A. Fischione Instruments, Inc.; Mr. Jeremy T. Harbaugh, E.A. Fischione Instruments, Inc.; Mr. Michael F. Boccabella, E.A. Fischione Instruments, Inc.; Mr. Paul Fischione, E.A. Fischione Instruments, Inc.
4:20 PM
In-line Electron Beam Inspection of high aspect-ratio RMG FINFET gate
Mr. Richard Hafer, GLOBALFOUNDRIES; Dr. Oliver D. Patterson, GLOBALFOUNDRIES; Cathy Gow, GLOBALFOUNDRIES; Derek McKindles, GLOBALFOUNDRIES; Brian Yueh-Ling Hsieh, Hermes Microvision Inc; Mr. Xiaohu Tang, Hermes Microvision Inc
4:45 PM
Automated Energy Dispersive X-ray Spectroscopy (EDS) for Metrology on Semiconductor Devices
Dr. Justin Roller, ThermoFisher Scientific (formerly FEI); Dr. Zhenxin Zhong, ThermoFisher Scientific (formerly FEI); Mr. Michael Strauss, ThermoFisher Scientific (formerly FEI); Oleksii Bidiuk, ThermoFisher Scientific (formerly FEI); Mr. Jeff Blackwood, Thermo Fisher Scientific; Dr. Martin Verheijen, ThermoFisher Scientific (formerly FEI); Dr. Ozan Ugurlu, ThermoFisher Scientific (formerly FEI); Jason Donald, ThermoFisher Scientific (formerly FEI)
See more of: Technical Program