Poster Session I

Tuesday, December 8, 2020: 1:20 PM-2:50 PM
Dr. Felix Beaudoin, GLOBALFOUNDRIES
1:20 PM
FAULT ISOLATION: In-SEM Fault Isolation Using Voltage Contrast, EBIC/EBAC and Resistive Contrast Imaging
Ms. Lori Sarnecki, ON Semiconductor; Mr. Caleb Daigneault, ON Semiconductor
1:35 PM
FAULT ISOLATION: Bridge defect case inside digital circuitry
Mr. Angelo Antonio Merassi, STMicroelectronics; Mr. Matteo Medda, STMicroelectronics
1:50 PM
FAULT ISOLATION: Unlocking novel FA case studies using a Lock-in Amplifier
Mr. Sukho Lee, NXP Semiconductors; Dr. Marc van Veenhuizen, NXP Semiconductors; Dr. Paolo Navaretti, Zurich Instruments; Dr. Gaia Donati, Zurich Instruments
2:05 PM
PRODUCT YIELD, TEST & DIAGNOSTICS: A Minor Change in a Sample Preparation Leads to Unexpected Qualification Fails During High Temperature Storage Stress Test
Mr. Klaus Peter Tschernay, ams AG; Dr. Thomas Haber, ams AG
2:20 PM
PRODUCT YIELD, TEST & DIAGNOSTICS: Study of Retention Time Variation Due to Electric Field Change by Adjacent Word-line in DRAM
Mr. Dongsuck Kang, Samsung Electronics
2:35 PM
PRODUCT YIELD, TEST & DIAGNOSTICS: A Study on the Early Detection of Metal Line Bridge Defects Using Wafer Burn-in Stress
Mr. Kyunghwui Min, Samsung Electronics; Mrs. Hayoung Kwon, Samsung Electronics; Mr. Seihui Lee, Samsung Electronics; Dr. Sungsoo Yim, Samsung Electronics; Mr. Heeil Hong, Samsung Electronics Co.,Ltd; Mr. Jonghoon Kim, Samsung Electronics; Mr. Jung-Bae Lee, Samsung Electronics
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