Microscopy and Material Characterization
Thursday, November 4, 2021: 1:20 PM-3:50 PM
105 AB (Phoenix Convention Center)
| * Electron Microscopy (SEM, EBSD, EDX, TEM, EELS) |
| * SIMS, XPS, ICPMS, RBS, Auger, etc... |
| * Mechanical testing and simulation |
Mr. Ryan Fredrickson, On Semiconductor and Dr. Lianfeng Fu, Lam Research Corporation
1:20 PM
(V) In situ electrical biasing of electrically connected TEM lamellae with embedded nanodevices
Ms. Maria BRODOVOI, STMicroelectronics, CEMES – Centre National de la Recherche Scientifique (CNRS);
Mr. Kilian Gruel, CEMES – Centre National de la Recherche Scientifique (CNRS);
Mr. Lucas Chapuis, CEMES – Centre National de la Recherche Scientifique (CNRS);
Dr. Aurélien Masseboeuf, CEMES – Centre National de la Recherche Scientifique (CNRS);
Dr. Cécile Marcelot, CEMES – Centre National de la Recherche Scientifique (CNRS);
Dr. Martin Hÿtch, CEMES – Centre National de la Recherche Scientifique (CNRS);
Dr. Frederic Lorut, STMicroelectronics;
Dr. Christophe GATEL, CEMES – Centre National de la Recherche Scientifique (CNRS), University Paul Sabatier
2:35 PM
Low angle annular dark field scanning transmission electron microscopy analysis of phase change material
Dr. Juntao Li, IBM Research;
Dr. Kevin Brew, IBM Research;
Dr. Kangguo Cheng, IBM Research;
Dr. Victor Chan, IBM Research;
Dr. Ning Li, IBM Research;
Mr. Arthur Gasasira, IBM Research;
Dr. Norbert Arnold, IBM Research;
Mr. Ruturaj Pujari, IBM Research;
Dr. James J. Demarest, IBM Research;
Mr. Michael Iwatake, IBM Research;
Mr. Lukas Tierney, IBM Research;
Mr. Odunayo Ogundipe, IBM Research;
Mr. Kerry Toole, IBM Research
