FIB Sample Preparation

Thursday, November 4, 2021: 1:20 PM-3:50 PM
104 ABC (Phoenix Convention Center)
* FIB prep for SEM/TEM
* FIB related artefacts
* Mulit-ion Source Plasma-FIB
Dr. Cathy Vartuli, Butterfly Network and Ms. Rose Ring, Howard Hughes Research Labs
1:20 PM
(V) Automated TEM Workflow for Inline Defect Characterization
Dr. Hyun Woo Shim, Intel Corporation; Dr. Taehun Lee, Intel Corporation; Dr. Jonghan Kwon, Intel Corporation
1:45 PM
(V) Thickness Control and Targeting in Large Scale Automated XTEM Lamella Preparation
Dr. Vikas Dixit, Intel Corporation; Dr. Bryan D Gauntt, Intel Corporation; Dr. Taehun Lee, Intel Corporation
2:10 PM
(V) Accurate sub-micron device delayering of plan view TEM specimens by post-FIB Ar ion milling
Dr. Cecile S. Bonifacio, E.A. Fischione Instruments, Inc.; Dr. Pawel Nowakowski, E.A. Fischione Instruments, Inc.; Mr. Richard Li, E.A. Fischione Instruments, Inc.; Ms. Mary Ray, E.A. Fischione Instruments, Inc.; Mr. Paul Fischione, E.A. Fischione Instruments, Inc.
2:35 PM
(V) Plasma Etching Pre-treatment for a TEM Lamella Preparation of 3D NAND with High Aspect Ratio
Dr. Yu-Chih Chen, Macronix International Co., Ltd.; Mr. Bing-Chang Li, Macronix International Co., Ltd.; Mrs. Pei-Ling Hsu, Macronix International Co., Ltd.; Mr. Tsung-Yi Lin, Macronix International Co., Ltd.; Mr. I-An Chen, Macronix International Co., Ltd.; Dr. Chun-Hung Lin, Macronix International Co., Ltd.; Dr. Hsin-Cheng Hsu, Macronix International Co., Ltd.; Mr. Chin-Chih Yeh, Macronix International Co., Ltd.; Mr. Nan-Tzu Lian, Macronix International Co., Ltd.; Mr. Ta-Hone Yang, Macronix International Co., Ltd.; Mr. Kuang-Chao Chen, Macronix International Co., Ltd.
3:00 PM
(V) Nanomilling and STEM Imaging of Sub-50 nm InP HEMT
Dr. Besmeh Farhan Raya, Northrop Grumman
3:25 PM
(V) Plasma FIB Delayering and Nanoprobe EBIRCH for Localizing DRAM Metal Short
Mr. EuiSeok KIM, SK Hynix; Mr. JaeYun LEE, SK Hynix; Mrs. JiHyun LEE, SK Hynix
See more of: Technical Program