Microscopy and Material Analysis I

Thursday, November 3, 2022: 10:35 AM-12:30 PM
Ballroom B (Pasadena Convention Center)
* Electron Microscopy (SEM, EBSD, EDX, TEM, EELS)
* SIMS, XPS, ICPMS, RBS, Auger, etc...
* Mechanical testing and simulation
Dr. Wenbing Yun, PhD, Sigray, Inc. and Mr. Curtis Schreck, Analog Devices
10:35 AM
High-Resolution Conductivity Mapping with STEM EBIC
Dr. William A Hubbard, PhD, NanoElectronic Imaging, Inc.; Mr. Ho Leung Chan, University of California, Los Angeles; Prof. B.C. Regan, University of California, Los Angeles
11:00 AM
Overcoming challenging Failure Analysis sample types on a single IR/Raman platform!
Mr. Jay Anderson, Photothermal Spectroscopy Corp.; Dr. Michael K. Lo, PhD, Photothermal Spectroscopy Corp.; Dr. Eoghan Dillon, PhD, Photothermal Spectroscopy Corp.; Dr. Mustafa Kansiz, PhD, Light Light Solutions
11:25 AM
Building a Better Lab Space for High Tech Imaging/Processing Tools
Mr. Steven B. Herschbein, Independent Consultant; Ms. Cheryl Hartfield, Carl Zeiss SMT Inc., PCS; Mr. Michael Wong, Thermo Fisher Scientific; Mr. Joshua W. Kevek, Intel
11:50 AM
TEMautoReporting: Automation of elemental analysis and TEM reporting with GUI (Graphical User Interface)
Dr. Yougui Liao, Micron Technology; Mr. Tom Kari, Micron Technology; Mr. Curt Sorensen, Micron Technology; Mr. Rob Goodwin, Micron Technology; Mr. Scott Williams, Micron Technology; Mr. Robert Wilkin, Micron Technology; Mr. Scott Gatzemeier, Micron Technology
12:15 PM
See more of: Technical Program