AI Applications for Failure Analysis

Tuesday, November 14, 2023: 10:10 AM-11:30 AM
104 A-B (Phoenix Convention Center)
Dr. Yougui Liao, Micron Technology and Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS
10:10 AM
Advances in high-resolution non-destructive defect localization based on Machine Learning enhanced signal processing
Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems; Mr. Michael Koegel, Fraunhofer IMWS; Mr. Christian Grosse, Fraunhofer Institute for Microstructure; Mr. Frank Altmann, Fraunhofer Institute for Microstructure of Materials and Systems; Dr. Christian Hollerith, Infineon Technologies AG; Mr. Pascal Gounet, STMicroelectronics
10:30 AM
Fully Automated AI based crack detection on Pad-Over-Active-Areas
Mr. Florian Felux, Infineon Technologies AG; Mr. Daniel Pfister, Infineon Technologies AG; Dr. Christian Hollerith, Infineon Technologies AG; Mr. Andreas Jansche, Matworks GmbH; Mr. Matias Oscar Volman Stern, Matworks GmbH
10:50 AM
Dimensionality Reduction and Clustering of Wafer-Level Data to Optimize Use of Failure Analysis Resources
Mr. James David De La Torre, Intel Corporation; Mr. Don Kent, Intel Corporation; Mr. David Pivin, Intel; Mr. Eric St Pierre, Intel Corporation
11:10 AM
Multimodal Named Entity Recognition for Semiconductor Failure Analysis
Ms. Anna Safont-Andreu, Infineon Tech. Austria AG; Ms. Corinna Grabner, Universität Klagenfurt; Mr. Christian Burmer, Infineon Tech. AG; Dr. Konstantin Schekotihin, Universität Klagenfurt
See more of: Technical Program
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