Case Studies and Device Analysis

Tuesday, November 14, 2023: 10:10 AM-11:50 AM
103 A-B (Phoenix Convention Center)
Mr. Greg Johnson, ZEISS Microscopy and Dr. Yuyan Wang, Texas Instruments
10:10 AM
Electrical Fault Isolation of Stuck at Reset Hard Failures
Ms. Amrutha Sampath, NXP Semiconductors; Mr. Kristofor Dickson, NXP Semiconductors; Mr. Carey Wu, NXP Semiconductors
10:30 AM
A comprehensive Failure Analysis Approach Utilizing High Resolution Targeted Patterns (HRTP) for ATPG Diagnosis Resolution Improvement, Test Coverage Resolution, and Further Fault Localization
Mr. Rommel Estores, onsemi; Mr. Eric Barbian, On Semiconductor; Mr. Karl Villareal, onsemi; Mr. Lahcen boukhanfra, onsemi; Mr. Andrew Sabate, On-semiconductor
10:50 AM
Intricacies in the Failure Analysis of Integrated Capacitors
Mr. Raymond G. Mendaros, Analog Devices General Trias (ADGT); Mr. Ricardo Calanog, Analog Devices General Trias (ADGT); Mr. Christopher Mahinay, Analog Devices General Trias (ADGT); Mr. Christian reyes, Analog Devices General Trias (ADGT)
11:10 AM
Laser voltage characterization of transition delay failures in combinatorial logic
Mr. Angelo Antonio Merassi, STMicroelectronics; Mr. Andrea Boglio, STMicroelectronics
11:30 AM
Enhancing Device Margins Using Double-Gate Oxide in Buried-Gat FETs
Mr. Youmin KIM, Sungkyunkwan University
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