Case Studies and the Failure Analysis Process II

Thursday, November 13, 2014: 8:00 AM-9:40 AM
310 B (George R. Brown Convention Center )
Session Chairs:
Dr. Zhigang Song and Prof. Peter Jacob
8:00 AM
Incorporating a Compact Scan Diagnostic System Enhances the Failure Analysis Flow
Mr. Rommel Estores, ON Semiconductor; Pascal Vercruysse, ON Semiconductor; Karl Villareal, ON Semiconductor; Mr. Eric Barbian, ON Semiconductor; Mr. Ralph Sanchez, Teseda; Mr. Rich Ackerman, Teseda
8:25 AM
Determination of the Source of an Electrical Over Stress Event to a Digital Variable Gain Amplifier Module
Ms. Thiri Htun, TriQuint Semiconductor; Mr. Steve Brockett, TriQuint Semiconductor, Inc.
8:50 AM
Temperature-Dependent Logic Failure in a GaAs Power Amplifier-Duplexer Module Caused by a Subtle Parasitic Schottky Diode
Dr. Rose Emergo, TriQuint; Mr. Steve Brockett, TriQuint Semiconductor, Inc.; Mr. Pat Hamilton, TriQuint
9:40 AM
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