Nanoprobing and Electrical Characterization I

Monday, November 7, 2016: 12:35 PM-1:50 PM
110AB (Fort Worth Convention Center)
Chairs:  Mr. Randall Mulder, Freescale Semiconductor, Inc., Austin, TX
Co-chairs:  Ms. Sweta Pendyala, GLOBALFOUNDRIES, Hopewell Junction, NY
12:35 PM
Intra-Device Defect Localization through EBIC/EBAC combined with Electrical Nano-probing for FinFET Devices Composed of Multiple Sub-elements
Dr. Daminda Dahanayaka, Globalfoundries; Mr. Daniel A. Bader, Globalfoundries; Mr. Dennis P. Prevost Jr., Globalfoundries; Mr. Michael T. Coster, Globalfoundries; Dr. Erik F. Mccullen, Globalfoundries
1:00 PM
Diamond Probe Applications for Nanoprobing
Ms. Sweta Pendyala, Globalfoundries; Mr. Andrew Dalton, Globalfoundries; Mr. Sean Zumwalt, FEI; Mr. John Miller, FEI
1:25 PM
Further Localization of the Minor Junction Leakage Fault by Nano-Probing
Mr. Hung-Sen Wang, Taiwan Semiconductor Manufacturing Company; Mr. Chun-Chuan Lin, Taiwan Semiconductor Manufacturing Company; Mr. Tsai-Yi Sung, Taiwan Semiconductor Manufacturing Company; Mr. Kuo-Ching Chang, Taiwan Semiconductor Manufacturing Company; Mr. Shih-Chi Yang, Taiwan Semiconductor Manufacturing Company; Mr. Wei-Shuo Hung, Taiwan Semiconductor Manufacturing Company
See more of: Technical Program
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