FIB Sample Preparation

Thursday, November 10, 2016: 8:00 AM-9:40 AM
110AB (Fort Worth Convention Center)
Co-Chair:  Dr. Bryan Tracy, PhD, Freescale Semiconductor, Inc., Austin, TX
8:00 AM
CLM operation monitoring and maintenanace for tool matching
Dr. JANGBAE JEON, GLOBALFOUNDRIES
8:25 AM
Plasma-FIB sample preparation for X-ray tomography of 3D-IC interconnects
Dr. Guillaume Audoit, CEA, LETI, MINATEC Campus; Mr. Guillaume Delpy, FEI Europe B.V.; Dr. Pierre Bleuet, CEA, LETI, MINATEC Campus; Mr. Laurens Kwakman, FEI Europe B.V.
8:50 AM
Improved Method of ROI Encapsulaton During Axis Conversion of Cross-Sectional S/TEM Lamellae
Mr. Corey Senowitz, Qualcomm Technologies Inc.; Lesly Endrinal, Qualcomm Technologies Inc.; Mr. Hieu Nguyen, Qualcomm Technologies Inc.; Dr. Lavakumar Ranganathan, Qualcomm Technologies Inc.; Ms. Ruby Vollrath, Qualcomm Technologies Inc.; Dr. Caiwen Yuan, Qualcomm Technologies Inc.
9:15 AM
INVITED TALK: Acquiring Automated and Unattended Serial Section Datasets in the FIB/SEM: What can be done with 2000 image slices?
Mr. Michael W. Phaneuf, Fibics Incorporated
See more of: Technical Program
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