Dr. Heiko Stegmann

Staff Scientist Crossbeam Application
Carl Zeiss Microscopy GmbH
Oberkochen Germany 73447

Papers:

Basics and Current Aspects of Scanning Electron Microscopy
Combining three-dimensional FIB-SEM imaging and EBIC to characterize power semiconductor junctions
A Multiscale and Multimodal Correlative Microscopy Workflow to Characterize a Copper Segregation Identified in Epitaxial Layer in Power MOSFETs
In-situ Junction Analysis in SiC (and GaN)
FIB-SEM tomography acquisition and data processing optimization for logic and memory structures
Power Electronics Failure Analysis
Phase Segmentation in a Superjunction MOSFET using FIB-SEM tomography and 3D EDX