Dr. Heiko Stegmann

EMEA Applications Support Crossbeam
Carl Zeiss Microscopy GmbH
Oberkochen, Oberkochen
Italy 73447

Papers:

A step towards automation in failure analysis by FIB-SEM 3D tomography and AI segmentation
Basics and Current Aspects of Scanning Electron Microscopy
AI-based image segmentation for the characterization of bond pads after
Advanced method for 3D FIB tomography AI supported on SRAM I/O circuit block with missing data bits problems
First and Preliminary Approach at the Usage of FIB ToF for Borophosphilicate Layer Characterization Directly on Device Failing Structures
Power Devices (Si, SiC, GaN) - Investigation of early photon emission (PEM) in GaN-on-Si HEMTs, part I
Low impact analysis of junctions in power devices