7
Session 7: Defect Characterization and Metrology

Tuesday, November 5, 2013: 1:05 PM-4:15 PM
Meeting Room 230B (San Jose McEnery Convention Center)
Session Chairs:
Mr. Phil Kaszuba and Mr. Terence Kane
1:05 PM
7.1
Surface Microstructure Evolution Upon Silicidation of Ni(Pt) and the Different Responses to Metal Etch
Dr. Wentao Qin, ON Semiconductor; Dr. Dorai Iyer, ON Semiconductor; Dr. Mike Thomason, ON Semicondcutor; Dr. Jim Morgan, ON Semiconductor; Dr. Carroll Casteel, ON Semiconductor; Mr. Robert Watkins, ON Semiconductor; Mr. Rod Crowder, ON Semiconductor
1:30 PM
7.2
Gate Leakage Characterization and Fail Mode Analysis On 20 Nm Technology Parametric Test Structures
Mr. Satish Kodali, GLOBALFOUNDRIES; Mr. Gregory M. Johnson, IBM; Dr. Felix Beaudoin, IBM; Dr. Wayne Zhao, GLOBALFOUNDRIES
1:55 PM
7.3
STEM EDX Mappings and Tomography for Process Characterization and Physical Failure Analysis of Advanced Devices
Mr. Kevin Lepinay, STMicroelectronics; Dr. Frederic Lorut, STMicroelectronics; Dr. Roland Pantel, STMicroelectronics; Dr. Thierry Epicier, INSA Lyon
2:20 PM
7.4
Simulation Studies On Fluorine Spec Limit for Process Monitoring
Dr. Lei Zhu, GLOBALFOUNDRIES Singapore; Dr. Y. N. Hua, GLOBALFOUNDRIES Singapore Pte Ltd; Dr. Ramesh Rao Nistala, GLOBALFOUNDRIES Singapore Pte Ltd; Ms. Yanjing Yang, GLOBALFOUNDRIES Singapore Pte Ltd; Dr. SiPing Zhao, GLOBALFOUNDRIES Singapore; Mr. Shailesh Redkar, GLOBALFOUNDRIES Singapore; Ms. Rose Ring, GLOBALFOUNDRIES Malta
2:45 PM
Break
3:00 PM
7.5
Automatic Registering and Stitching of TEM/STEM Image Mosaics
Dr. Chung-Ching Lin, IBM T.J. Watson Research Center; Mr. Franco Stellari, IBM T.J. Watson Research Center; Lynne Gignac, IBM T.J. Watson Research Center; Peilin Song, IBM T.J. Watson Research Center; John Bruley, IBM T.J. Watson Research Center
3:25 PM
7.6
AFM-Based Chemical and Mechanical Property Characterization of Interconnects in Semiconductors
Dr. Michael K. Lo, Anasys Instruments
3:50 PM
7.7
Evaluation of Digital Holography Microscopy for Roughness Control Prior Wafer Direct Bonding
Dr. Bernadette Domengès, LAMIPS, CRISMAT – NXP semiconductors - Presto-Engineering Europe laboratory, CNRS-UMR6508; ENSICAEN, UCBN; Dr. Thomas Delaroque, Presto-Engineering Europe; Mr. Christian Gautier, Presto-Engineering Europe; Dr. Karine Danilo, Presto-Engineering Europe; Mr. Erwan LeFlao, EADS Astrium
See more of: Symposium
<< Previous Session | Next Session >>