Device Analysis - Case Studies II

Tuesday, November 18, 2025: 12:50 PM-2:10 PM
2 (Pasadena Convention Center)
12:50 PM
Effectiveness of Photon Emission Microscopy in identifying intrinsic device reliability issues and aiding design debug
Ms. Amrutha Sampath, NXP Semiconductors; Mr. Kristofor Dickson, NXP Semiconductors; Mr. Carey Wu, NXP Semiconductors
1:10 PM
Understanding the Latent Impact of Residual Particles in 3D NAND
Xiaochen Zhu, Sandisk Technologies Inc; Mina Rashetnia, Sandisk Technologies Inc; Elliott Rill, Sandisk Technologies Inc; Lito De La Rama, Sandisk Technologies Inc
1:30 PM
Innovative Pattern Modification for Hard Failure Diagnosis Using Dynamic Laser Stimulation
Mr. Kan Sun, QUALCOMM; Mr. Hao Hu, QUALCOMM; Mr. Soon Woei Chong, Qualcomm Global Trading Pte Ltd.; Silambarasan Karuppannan, Qualcomm Global Trading Pte Ltd.; Mr. Wan Abdul Rahman, Qualcomm Global Trading Pte Ltd.; Mr. Rahul Babu Radhamony, QUALCOMM; Mr. Cheng Hoe lee, Qualcomm
1:50 PM
Case Study: Nanoprobe Verification of EOS Induced Resistor-Capacitor Oscillator Frequency Shift Failure
Mr. Randy Mulder, Silicon Labs
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