J. C. Lam
VP
GLOBALFOUNDRIES Singapore Pte Ltd
Product, Test and Failure Analysis
60 Woodlands Industrial Park D Street 2, Singapore 738406
Singapore
Singapore
738406
Papers:
Failure Analysis Methodology on Systematic Missing Cu in RAM Due to Cu CMP
Failure Analysis Methodology on Resistive Open Defects
Applications of AFP Nanoprobing for Localization of Implant Related Issues
Effective and Efficient FEOL Defects Localization/ Inspection By Selective Mechanical/Chemical Deprocessing
Utilizing Nanoprobing and Circuit Diagnostics to Identify Key Failure Mechanism of Otherwise Non-Visible Defects in 20nm Logic Devices
Application of Soft Defect Localization (SDL) for SRAM Soft Failure Debug
Investigation of Protection Layer Materials for Ex-situ 'lift-out' TEM sample Preparation Technique with FIB for 14nm FinFET
Application of Fast Laser Deprocessing Techniques in Physical Failure Analysis on SRAM Memory of Advance Technology
Understanding the Cu Void Formation by TEM Failure Analysis