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Exposition
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Program-at-a-Glance
Technical Program
SUNDAY
November 12
MONDAY
November 13
TUESDAY
November 14
WEDNESDAY
November 15
THURSDAY
November 16
AM
PM
AM
PM
AM
PM
AM
PM
AM
PM
Symposium
Session 1: Advanced Techniques 1
10:15 AM - 11:30 AM
Session 2: System Level Analysis
1:30 PM - 2:45 PM
Session 3: Test and Diagnostics
1:30 PM - 2:45 PM
Session 5: Scanning Probe Microscopy
3:05 PM - 4:45 PM
Session 4: Circuit Edit and Beam-based Sample Preparation
3:05 PM - 5:10 PM
Session 6: Panel Discussion
5:30 PM - 7:30 PM
Session 7: Package Level Analysis 1
10:20 AM - 11:35 AM
Session 8: Discretes, Passives, MEMS, and Optoelectronics
10:20 AM - 12:25 PM
Session 9: Posters
12:25 PM - 2:25 PM
Session 10: Metrology and Materials Analysis 1
3:55 PM - 6:00 PM
Session 11: Die Level Fault Isolation
3:55 PM - 6:00 PM
Session 13: Chemical and Mechanical Sample Preparation
8:00 AM - 9:15 AM
Session 12: Metrology and Materials Analysis 2
8:00 AM - 9:40 AM
Session 14: Advanced Techniques 2
9:55 AM - 12:00 PM
Session 15: Yield Analysis
9:55 AM - 12:00 PM
Session 16: Optical Fault Isolation
1:20 PM - 3:00 PM
Session 17: Analytical Process
1:20 PM - 3:00 PM
Session 18: Package Level Analysis 2
3:15 PM - 4:55 PM
Session 19: Nanotechnology and Nanoprobing
3:15 PM - 5:20 PM
Tutorial
Device and Memory FA
8:15 AM - 12:00 PM
FA Basics
8:15 AM - 12:00 PM
Packaging
8:15 AM - 2:45 PM
Failure Mechanisms
1:00 PM - 3:30 PM
Microscopy Tools
1:00 PM - 6:45 PM
EOS/ESD
2:45 PM - 6:45 PM
Emerging Technologies
3:45 PM - 6:45 PM
Yield
8:00 AM - 9:00 AM
Focused Ion Beam
8:00 AM - 10:15 AM
Test and Logic Diagnostics
8:00 AM - 4:15 PM
Fault Isolation
9:00 AM - 6:15 PM
MEMS Devices
10:30 AM - 3:00 PM
Lead Free Packaging
3:15 PM - 4:45 PM
Lab Management
4:15 PM - 6:15 PM
Materials Characterization
4:45 PM - 6:15 PM
