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Symposium Opening/Awards Presentation/Keynote Speaker/IPFA 2010 Best Paper Award/TCP Introduction
8:00 AM - 9:40 AM
Session 1: Emerging FA Techniques and Concepts
10:00 AM - 12:05 PM |
Session 3: Packaging and Assembly Level FA I
1:20 PM - 2:35 PM
Session 2: FA Process/Case Studies
1:20 PM - 3:50 PM
Session 4: Sample Preparation for Technological Analysis
2:35 PM - 3:50 PM
Session 5: Defect Characterization & Metrology - I
4:05 PM - 5:20 PM
Session 6: Sample Prep for Chip Access and Device Deprocessing
4:05 PM - 5:20 PM
User's Group 1: SEM
5:20 PM - 7:00 PM
User's Group 2: Sample Preparation
5:20 PM - 7:00 PM |
Session 7: Alternative Energy (Photovoltaics, Solid State Lighting, etc.)
8:00 AM - 9:40 AM
Session 8: Sample Prep for Chip Access and Device Deprocessing 2
8:00 AM - 10:05 AM
Session 9: Board and System Level FA
10:20 AM - 11:35 AM
Session 10: Photon Based Techniques I
10:20 AM - 12:00 PM |
EDFAS General Membership Meeting & Networking Luncheon
12:00 PM - 1:10 PM
Expo Only Hour
1:10 PM - 2:10 PM
Session 11: Posters
2:10 PM - 3:10 PM
Session 13: Defect Characterization & Metrology - II
3:10 PM - 4:50 PM
Session 12: MEMS, Discretes and Optoelectronic Device FA
3:10 PM - 5:15 PM
Session 14: Test and Diagnostic, Test and Debug
4:50 PM - 6:30 PM
Session 15: Cicuit Edit I
5:15 PM - 6:05 PM |
Session 16: Counterfeit Electronics – Risks and Mitigation
8:00 AM - 9:40 AM
Panel Discussion
9:40 AM - 10:35 AM
Session 17: Photon Based Techniques II
10:50 AM - 12:55 PM
Session 18: Nanoprobing and Nano Scale Electronic Characterization
10:50 AM - 12:55 PM |
Session 19: Circuit Edit II (Laser, FIB, etc.)
1:55 PM - 3:10 PM
User's Group 4: Nanoprobing
1:55 PM - 3:35 PM
User's Group 3: FIB
3:10 PM - 4:50 PM
Session 20: Packaging and Assembly Level FA II
3:35 PM - 4:50 PM |
