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Program-at-a-Glance


Technical Program

 SUNDAY
November 4		 MONDAY
November 5		 TUESDAY
November 6		 WEDNESDAY
November 7		 THURSDAY
November 8
AM PM AM PM AM PM AM PM AM PM
Symposium         Session 1: Emerging Concepts
10:00 AM - 11:40 AM 		 Session 2: Circuit Edit 1
1:30 PM - 2:45 PM
Session 3: SPM Techniques
1:30 PM - 2:45 PM
Session 4: Sample Preparation
3:05 PM - 4:20 PM
Session 5: Photon Based Techniques
3:05 PM - 4:20 PM 		 Session 7: Package and Assembly Level FA 1
10:20 AM - 12:00 PM
Session 6: In-line Metrology and Inspection
10:20 AM - 12:25 PM 		 Session 8: Posters
1:45 PM - 3:00 PM
Session 9: Package and Assembly Level FA 2
4:00 PM - 5:15 PM
Session 10: Nanoprobing
4:00 PM - 5:40 PM 		 Session 11: Package and Assembly Level FA 3
9:50 AM - 11:05 AM
Session 12: Failure Analysis Process 1
9:50 AM - 11:05 AM
Session 13: Yield Enhancement
11:00 AM - 1:05 PM
Session 14: System Level Analysis and Test
11:00 AM - 1:05 PM 		 Session 15: Circuit Edit 2
2:00 PM - 3:15 PM
Session 16: Failure Analysis Process 2
2:00 PM - 3:40 PM 
Tutorial Materials Characterization
8:15 AM - 10:15 AM
FA Basics
8:15 AM - 12:00 PM
Packaging
8:15 AM - 2:45 PM
FIB
10:30 AM - 2:30 PM 		 Microscopy Tools
1:00 PM - 6:45 PM
Lead Free Packaging
2:30 PM - 3:45 PM
Device and Memory FA
2:45 PM - 6:45 PM
Failure Mechanisms
4:00 PM - 5:30 PM
Emerging Technologies
5:30 PM - 6:45 PM 		 EOS/ESD
8:00 AM - 11:15 AM
Test and Logic Diagnostics
8:00 AM - 4:15 PM
Fault Isolation
8:00 AM - 6:15 PM
MEMS Devices
11:15 AM - 3:00 PM 		 Analog Device Failure Analysis
3:15 PM - 5:15 PM
Lab Management
4:15 PM - 6:15 PM
Yield
5:15 PM - 6:15 PM