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Sunday, November 4, 2007
8:15 AM-10:15 AM
Tutorial Materials Characterization
8:15 AM-12:00 PM
Tutorial FA Basics
8:15 AM-2:45 PM
Tutorial Packaging
10:30 AM-2:30 PM
Tutorial FIB
1:00 PM-6:45 PM
Tutorial Microscopy Tools
2:30 PM-3:45 PM
Tutorial Lead Free Packaging
2:45 PM-6:45 PM
Tutorial Device and Memory FA
4:00 PM-5:30 PM
Tutorial Failure Mechanisms
5:30 PM-6:45 PM
Tutorial Emerging Technologies
Monday, November 5, 2007
8:00 AM-11:15 AM
Tutorial EOS/ESD
8:00 AM-4:15 PM
Tutorial Test and Logic Diagnostics
8:00 AM-6:15 PM
Tutorial Fault Isolation
11:15 AM-3:00 PM
Tutorial MEMS Devices
3:15 PM-5:15 PM
Tutorial Analog Device Failure Analysis
4:15 PM-6:15 PM
Tutorial Lab Management
5:15 PM-6:15 PM
Tutorial Yield
Tuesday, November 6, 2007
10:00 AM-11:40 AM
Symposium 1 Session 1: Emerging Concepts
1:30 PM-2:45 PM
Symposium 2 Session 2: Circuit Edit 1
Symposium 3 Session 3: SPM Techniques
3:05 PM-4:20 PM
Symposium 4 Session 4: Sample Preparation
Symposium 5 Session 5: Photon Based Techniques
Wednesday, November 7, 2007
10:20 AM-12:00 PM
Symposium 6 Session 7: Package and Assembly Level FA 1
10:20 AM-12:25 PM
Symposium 7 Session 6: In-line Metrology and Inspection
1:45 PM-3:00 PM
Symposium 8 Session 8: Posters
4:00 PM-5:15 PM
Symposium 9 Session 9: Package and Assembly Level FA 2
4:00 PM-5:40 PM
Symposium 10 Session 10: Nanoprobing
Thursday, November 8, 2007
9:50 AM-11:05 AM
Symposium 11 Session 11: Package and Assembly Level FA 3
Symposium 12 Session 12: Failure Analysis Process 1
11:00 AM-1:05 PM
Symposium 13 Session 13: Yield Enhancement
Symposium 14 Session 14: System Level Analysis and Test
2:00 PM-3:15 PM
Symposium 15 Session 15: Circuit Edit 2
2:00 PM-3:40 PM
Symposium 16 Session 16: Failure Analysis Process 2

View The 33rd International Symposium for Testing and Failure Analysis (November 4-8, 2007) At a Glance