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Session 1: Nanotechnology
8:45 AM - 9:10 AM
Session 2: Advanced Techniques
9:10 AM - 11:10 AM
Session 3: SPM Techniques 1
11:10 AM - 1:30 PM
Session 4: Test 1
11:10 AM - 1:30 PM |
Session 5: Package Level Analysis 1
1:30 PM - 3:55 PM
Session 6: Die Level Fault Isolation
1:30 PM - 3:55 PM
Session 7: Failure Analysis Process 1
3:55 PM - 5:40 PM
Session 8: Circuit Edit for FA, FI and Debug 1
3:55 PM - 5:40 PM |
Session 10: Optical Techniques 1
8:00 AM - 9:35 AM
Session 9: Test 2
8:00 AM - 9:35 AM
Session 11: Panel Discussion
9:35 AM - 1:45 PM
Session 12: MEMS
9:35 AM - 1:45 PM
Poster
11:40 AM - 1:45 PM |
Session 13: Metrology and Materials Analysis 1
1:45 PM - 4:10 PM
Session 14: System Level Analysis 1
1:45 PM - 4:10 PM
Session 15: Optoelectronic Devices
4:10 PM - 5:50 PM
Session 16: Sample Preparation 1
4:10 PM - 5:50 PM |
Session 17: SPM Techniques 2
8:00 AM - 10:25 AM
Session 18: Package Level Analysis 2
8:00 AM - 10:25 AM
Session 19: Yield Enhancement
8:00 AM - 10:25 AM
Session 20: Metrology and Materials Analysis 2
10:25 AM - 12:40 PM
Session 21: System Level Analysis 2
10:25 AM - 12:40 PM
Session 22: Optical Techniques 2
10:25 AM - 12:40 PM |
Session 23: Metrology and Materials Analysis 3
12:40 PM - 3:05 PM
Session 24: SPM Techniques 3
12:40 PM - 3:05 PM
Session 25: Failure Analysis Process 2
12:40 PM - 3:05 PM
Session 28: Test 3
3:05 PM - 4:45 PM
Session 26: Circuit Edit for FA, FI and Debug 2
3:05 PM - 5:00 PM
Session 27: Sample Preparation 2
3:05 PM - 5:00 PM |
