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Program-at-a-Glance


Technical Program

SUNDAY
November 6
MONDAY
November 7
TUESDAY
November 8
WEDNESDAY
November 9
THURSDAY
November 10
AM PM AM PM AM PM AM PM AM PM
Symposium       Scanning Optical Microscopy (SOM) User Group
7:00 PM - 8:30 PM 
Session 1: Advanced Techniques 1
9:25 AM - 10:40 AM
Session 2: Package Level Analysis 1
11:00 AM - 12:40 PM
Session 3: Die Level Fault Isolation
11:00 AM - 12:40 PM 
Session 4: Panel Discussion 1: Strategic Development in FA. What Can We Get From Other Technical Sources?
1:00 PM - 2:40 PM
Session 5: Panel Discussion 2: Can Competitors Build Some Common FA Facilities To Improve ROI And Efficiency?
1:00 PM - 2:40 PM
Session 6: Circuit Edit for FA, FI, and Debug
3:00 PM - 4:40 PM
Session 7: Case Histories 1
3:00 PM - 4:40 PM
EDFAS General Membership Meeting
4:45 PM - 5:15 PM
Focused Ion Beam (FIB) User Group
7:00 PM - 8:30 PM
Scanning Probe Microscopy (SPM) User Group
7:00 PM - 8:30 PM 
Session 8: Optical Techniques 1
8:00 AM - 9:40 AM
Session 9: System Level Analysis 1
8:00 AM - 9:40 AM
Session 10: Advanced Techniques 2
10:00 AM - 11:15 AM
Session 11: Case Histories 2
10:00 AM - 11:15 AM
Session 12: Poster/Luncheon
11:15 AM - 1:15 PM 
Session 13: Failure Analysis Process
2:15 PM - 3:55 PM
Session 14: SPM Techniques 1
2:15 PM - 3:55 PM
Session 15: Sample Preparation 1
4:15 PM - 5:55 PM
Session 16: Optoelectronic Devices
4:15 PM - 5:55 PM
Chip Access/Delayering User Group
7:00 PM - 8:30 PM
Nano Probe User Group
7:00 PM - 8:30 PM 
Session 17: Optical Techniques 2
8:00 AM - 9:15 AM
Session 18: Nanotechnology Analysis
8:00 AM - 9:15 AM
Session 19: Yield Enhancement
9:25 AM - 11:30 AM
Session 20: Discretes, Passives, and MEMS
9:25 AM - 11:30 AM 
Session 21: Metrology and Materials Analysis
1:00 PM - 3:05 PM
Session 22: System Level 2/Packaging 2/SPM 2
1:00 PM - 3:05 PM
Session 23: Sample Preparation 2
3:25 PM - 4:40 PM
Session 24: Test
3:25 PM - 4:40 PM 
Tutorial Introduction
8:00 AM - 8:10 AM
Failure Analysis Basics
8:15 AM - 10:30 AM
Device and Test 1
8:15 AM - 12:00 PM
Packaging 1
8:15 AM - 12:00 PM
Microscopy Tools 1
10:30 AM - 12:00 PM 
Yield
1:00 PM - 3:30 PM
Device and Test 2
1:00 PM - 6:30 PM
Microscopy Tools 2
1:00 PM - 6:30 PM
Sample Preparation
3:30 PM - 6:30 PM 
Fault Isolation 1
8:00 AM - 12:00 PM
MEMS
8:00 AM - 12:00 PM
Packaging 2
8:00 AM - 12:00 PM 
Fault Isolation 2
1:00 PM - 3:30 PM
Device and Test 3
1:00 PM - 4:15 PM
Microscopy Tools 3
1:00 PM - 6:15 PM
Failure Mechanisms
3:45 PM - 6:15 PM
Failure Analysis Laboratory Management
4:15 PM - 6:15 PM
Prize Drawing
6:15 PM - 6:30 PM